3D Microelectronic Packaging: From Fundamentals to - download pdf or read online

By Yan Li,Deepak Goyal

ISBN-10: 3319445847

ISBN-13: 9783319445847

This quantity presents a accomplished reference for graduate scholars and pros in either academia and at the basics, processing info, and purposes of 3D microelectronic packaging, an pattern for destiny microelectronic programs. Chapters written by means of specialists hide the latest examine effects and growth within the following parts: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, complicated fabrics, warmth dissipation, thermal administration, thermal mechanical modeling, caliber, reliability, fault isolation, and failure research of 3D microelectronic programs. various photographs, tables, and didactic schematics are incorporated all through. This crucial quantity equips readers with an in-depth figuring out of all facets of 3D packaging, together with packaging structure, processing, thermal mechanical and moisture similar reliability matters, universal disasters, constructing components, and destiny demanding situations, delivering insights into key parts for destiny study and development. 

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3D Microelectronic Packaging: From Fundamentals to Applications (Springer Series in Advanced Microelectronics) by Yan Li,Deepak Goyal


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